DMC TSC-34/U-L Especificaciones descargar pdf (Pagina 17)

TSC-40/IC Product S

ecification

80 to 150 °C (Package surface temperature)

260 °C max.

10s max. (Primary + Secondary flow

passage duration)

Time

Temperature

110

30s

175±15 °C

1 to 4 °C/s

220 °C or higher, 60s max.

255 °C or higher, 10-16s max.

260 °C max.

Time

Package’s surface temperature

8. Implementation Temperature Specification

1. Reflow method (Infrared reflow, air reflow)

Frequency: Three times or less

Temperature: The following device surface temperature profile is recommended.

Figure 1: Infrared reflow, air reflow temperature profile

2. Wave soldering method (Flow soldering, solder dip method)

Frequency: One time or less

Temperature: Following temperature profile is recommended (Set the optimal preheat temperature

according to the flux type)

Figure 2: Wave soldering temperature profile

3. Soldering iron (Manual soldering)

Soldering bit’s temperature: 370 °C or lower

Soldering time: Five seconds or less/terminal

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DMC TSC-34/U-L Especificaciones Pagina 17